Datacon Largest Provider of Semiconductor Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as flip chip and RFID (non-contact data transmission). Offering dynamic, flexible concept strategies and latest technologies, Datacon is known in the die bonder market as a solution supplier and an essential research partner for the semiconductor industry worldwide.
Smaller, faster, cheaper - using the latest microelectronics is a prerequisite for rapidly improving the quality in many areas of life. Datacon’s semiconductor packaging products help consumer goods become cheaper and more compact.
Our vision is to successfully contribute to the advancement of microelectronics by addressing and implementing the current and future requirements of the fast-moving Advanced Packaging Market. Datacon plays an important role in the technical and social success of microelectronics. Flexible Die Attach by flexible-die-attach-solutions.com |
